专利摘要:
The invention relates to a module carrier mounting system for substrate, which produces by at least two elements, a mounting block (3) and a connecting element (4), a mounting connection for the base of module carrier systems (1) via at least one screw (7). The mounting block (3) is fixedly connected to the substrate pad (2), whereby the substrate lying thereon can be used as a ballast. The wind suction force is transmitted via a positive connection (9) between the mounting block (3) and the connecting element (4) on the substrate. In this way can be dispensed with additional ballast stones in a collector module installation in substrate roofs or flat surfaces. This saves costs and speeds up the installation.
公开号:CH713105A2
申请号:CH01461/16
申请日:2016-11-02
公开日:2018-05-15
发明作者:WEHRLI Kilian
申请人:WEHRLI Kilian;
IPC主号:
专利说明:

Description: The present invention relates to a module carrier mounting system for substrate, which is distributed on the roof during a preceding process step and whereby the ballasting of the module carrier system is ensured via the module carrier mounting system and the substrate.
Various mounting systems in combination with substrate are available on the market from the prior art. Most of these are made of trays or plates, which must be positioned exactly in front of the substrate distribution and held during the substrate distribution. These systems offer the advantage that the substrate can be used for ballasting. However, they are time consuming to place and a majority of the assembly work must be done on the spot.
It is therefore an object of the present invention to provide a module carrier mounting system for substrates, which allows a simple and quick fixation of the installation, which reduces the assembly costs at the installation site, is easy to use and allows variable positioning of the modules.
This object is achieved by the invention by a mounting system according to claim 1. Advantageous embodiments and various embodiments are described in the dependent claims.
According to the present invention, a substrate substrate is provided with raster positioned mounting points, with which the module carrier systems can be connected in a quick and easy way. The module carrier systems could be particularly suitable for collector modules in the form of photovoltaic modules or thermal solar modules. The substrate backing in the present invention could be used in new construction or renovation of buildings or other flat surfaces. This substrate is laid on the roof or on the flat surface before the substrate is conveyed. After substrate promotion, these mounting points protrude out of the substrate. The screening of the mounting points may have different distances, as well as the mounting points may be different in shape and function. In addition to the fixation of the module carrier systems, which may also be of different makes, a fall protection system can also be integrated. According to the invention, with a rollable or foldable substrate backing, the mounting points are mechanically or chemically bonded thereto with a certain strength. The mounting points are ideally higher than the substrate thickness but may be smaller, but then use a contamination protection as a placeholder against the substrate. The connection between the module carrier system or the fall protection points and the mounting points can ideally be made via snap-in, screw, adhesive, magnet or another technical or mechanical system.
In the basic version ideally a Einrastsystem is provided with multiple hoes. The system can also be held by friction effect. Another sub-variant works with deformation forces. The suction force, which is passed through the modules to the mounting structure, is distributed in this case to many smaller breakpoints.
In another variant, a screw system is used, which ideally have a two-part screw thread, which ensures that, firstly, the connection is made and, second, that the strength of the connection is sufficient. These functions can be realized in one part or with two interlocking parts. A sub-variant could instead of the screw with a bolt or nail produce the strength of the connection.
[0008] According to yet another embodiment, an adhesive system would ideally guarantee an advanced contact adhesive system the connection. It could also be carried out by means of two-component adhesive.
Another variant could use a Magnetetaltesystems. The structure could look similar to an adhesive solution, except that the magnets and the counter plates or counter magnets could also be cast or incorporated into the material.
A mechanical holding system could also represent a variant. This could be understood as a clip system, a retaining clip or another mechanical locking system.
In addition to the solutions mentioned above, other variants may be possible, which are not explicitly listed in this document.
The rollable or foldable substrate substrate can be prefabricated on large areas. During installation, the pieces to be laid can be pre-cut from stock or at the installation site. The pieces to be laid are positioned approximately before substrate promotion. Fine adjustments can be made during the installation of the components, such as fall arrest points or module mounting system.
According to a further aspect of the present invention, the module carrier mounting system is provided for a collector module system or more collector module systems with a plurality of collector modules, which are arranged on a module carrier, wherein the collector module system with straight profiles can be foldable as well. The system is suitable for all types of flat collector modules, in particular for photovoltaic modules and thermal solar modules.
The invention has been illustrated with reference to several variants. The individual technical features of a variant may well be used in combination with another variant with the Darge laid benefits. The description of the inventive technical features is therefore not limited to the respective embodiment.
Advantageous embodiments of the invention are illustrated below with reference to the drawings, which are merely illustrative and not restrictive interpreted. Features of the invention which will become apparent from the drawings are to be considered individually and in any combination as belonging to the disclosure of the invention. In the drawings show:
1 is a schematic two-dimensional view of a first embodiment of the mounting connection in the unmounted state according to the invention,
1a is a schematic two-dimensional view of a first embodiment of the mounting connection in the assembled state according to the invention,
2 is a schematic two-dimensional view of a second embodiment in the non-assembled state according to the invention,
2a is a schematic two-dimensional view of a second embodiment in the assembled state according to the invention,
3 is a schematic two-dimensional view of a third embodiment in the non-assembled state according to the invention,
3a is a schematic two-dimensional view of a third embodiment in the assembled state according to the invention,
4 is a schematic two-dimensional view of a fourth embodiment in the non-assembled state according to the invention,
4a is a schematic two-dimensional view of a fourth embodiment in the assembled state according to the invention,
5 is a schematic two-dimensional view of a fifth embodiment in the non-assembled state according to the invention,
5a is a schematic two-dimensional view of a fifth embodiment in the mounted state according to the invention,
6 is a schematic three-dimensional view of the substrate substrate rolled without structures according to the invention,
7 shows a schematic three-dimensional view of the substrate support with structures according to the invention, in the figures, various embodiments of the module support mounting system for substrates according to the invention are shown. In the compilation, only one example of a possible arrangement is shown. In addition, the designs may differ from the figures. In Figs. 1 to 5 and the figures with the (a), the basic variants are shown unmounted and mounted. Figs. 6 and 7 show the substrate substrate before and after installation.
In Fig. 1 and 1a is a first embodiment of the module carrier mounting system with a hacking principle, wherein Fig. 1 shows the variant in the non-assembled and Fig. 1a shows the variant in the assembled state. The base of the module carrier system 1 can be equipped with the connecting element 4 before or during the installation. The screws 7 are needed for fixing. The screws 7 engage in the threads of the fixing plate 5. The substrate substrate 2 was previously equipped with the mounting blocks 3 according to the desired grid. The mounting block 3 and the connecting element 4 are advantageously made of natural rubber, which allows a certain flexibility and durability guaranteed. Other materials and material combinations are quite conceivable.
In Fig. 1a, the nails engage in the mounting blocks provided holes 8 during assembly. The distances of the nails and holes is chosen so that a rough placement is sufficient so that connecting element 4 comes to rest on the mounting block 3 to rest. Once assembled, the Pfeilkopfform 9 prevents the extraction of the connecting element, respectively, the separation of the connection. This connection is designed for the maximum wind suction loads encountered.
In Fig. 2 and 2a, a further embodiment of the module carrier mounting system with a screw principle, wherein Fig. 2 shows the variant in non-assembled and Fig. 2a shows the variant in the assembled state. In this embodiment, preferably nothing is preassembled on the basis of the module carrier system 1. The substrate substrate 2 was previously equipped with the mounting blocks 3 according to the desired grid. The mounting block 3 is advantageously made of natural rubber outside, which guarantees the durability. The core is advantageously made of a soft, spongy or fibrous material. Other materials and material combinations are quite conceivable. The screw 11 are already pre-assembled.
In Fig. 2a, the base of the module carrier system 1 is simply placed on the mounting blocks 3 during assembly. The clearance between the screw 11 and the openings in the base of the module carrier system 1 is chosen so that there are no problems with overlaps. The base of the module carrier system 1 can be screwed after the final alignment by means of screw plate 10 and the screws 7. In this fastening operation, the screw 11 are pressed apart, which significantly improves the anchorage. This connection is designed for the maximum wind suction loads encountered.
In Fig. 3 and 3a, a third embodiment of the module carrier mounting system with an adhesive principle, wherein Fig. 3 shows the variant in non-assembled and Fig. 3a shows the variant in the assembled state. The base of the module carrier system 1 can be equipped with the connecting element 4 before or during the installation. The screws 7 are needed for fixing. The screws 7 engage in the threads of the connecting element 4. On the lower surface, an adhesive pad 12 is attached or incorporated. The substrate substrate 2 was previously equipped with the mounting blocks 3 according to the desired grid. The mounting block 3 is advantageously made of natural rubber, which allows a certain flexibility and durability guaranteed. On the upper side of the mounting block 3, a contact surface 13 is attached or incorporated. This surface is equipped with the optimal structure for the gluing process. Other materials and material combinations are quite conceivable.
In Fig. 3a, the surfaces between the mounting blocks 3 and the connecting elements 4 is checked for cleanliness before positioning the base of the module carrier system 1. In the placement, shortly after the contact between the contact surface 13 and the adhesive pad 12, the contact is activated and strengthened. A final alignment must therefore be made immediately in this case. Once assembled, the connection can only be decoupled via the screws 7 and the base of the module support system. Each individual adhesive bond is designed for the maximum wind suction loads encountered.
In Fig. 4 and 4a, a fourth embodiment of the module carrier mounting system with a magnetic principle, wherein Fig. 4 shows the variant in the non-mounted and Fig. 4a shows the variant in the assembled state. The base of the module carrier system 1 can be equipped with the connecting element 4 before or during the installation. The screws 7 are needed for fixing. The screws 7 engage in the threads of the connecting element 4. The substrate substrate 2 was previously equipped with the mounting blocks 3 according to the desired grid. In the mounting block 3, the lower magnet block 14 and in the connecting element 4 of the upper magnet block 15 is advantageously poured into natural rubber, which allows a certain flexibility and durability guaranteed. Other materials and material combinations are quite conceivable.
In Fig. 4a, the surfaces between the mounting blocks 3 and the connecting elements 4 is checked for cleanliness before positioning the base of the module carrier system 1. When placed, the connection is immediately effective by the magnetic force. Advantageously, a gauge is used which prevents the base of the module carrier system 1 from being placed inaccurately. After placement, a correction or decoupling is only possible via the screws 7. Each individual magnetic connection is designed for the maximum wind suction loads encountered.
In Fig. 5 and 5a, a fifth embodiment of the module carrier mounting system with a mechanical principle, wherein Fig. 5 shows the variant in non-assembled and Fig. 5a shows the variant in the assembled state. The base of the module carrier system 1 can be equipped with the connecting elements 5, 19 and 21 before or during the installation. In this case, at least one latching bolt 19 is mounted by means of two fixing plates 5 and a pin fuse 21. The substrate substrate 2 was previously equipped with the mounting blocks 3 according to the desired grid. In the mounting block 3, at least one headband 18 is pre-assembled and the opening is protected by protective film 20 from substrate contamination. The mounting block 3 is advantageously made of natural rubber, which allows a certain flexibility and durability guaranteed. Other materials and material combinations are quite conceivable.
In Fig. 5a, the surfaces between the mounting blocks 3 and the lower fixing plate 5 is checked for cleanliness before positioning the base of the module carrier system 1. When placing snap lock 19 and headband 18 together. With automatic locking, the connection is already active. With a manual locking, the retaining bracket must still be pushed into the locking position. Advantageously, a gauge is used which prevents the base of the module carrier system 1 from being placed inaccurately. After placing a correction or decoupling is only possible via the displacement of the retaining clip 18. Each individual bolt locking connection is designed for the maximum wind suction loads encountered.
Fig. 6 shows the substrate substrate 2 with the preassembled in the predetermined grid mounting blocks 3. The substrate substrate 2 can be previously tailored to the application. Rolled up or folded it is then placed on the roof or the prepared flat surface and rolled out as in Fig. 6 or unfolded. It can also be laid several small pieces on the mounting surface. A smaller area of substrate substrate 2 must have a certain minimum area, depending on the wind load.
Fig. 7 shows the substrate substrate 2 with the preassembled in the predetermined grid mounting blocks 3 including the substrate filling 16 and the base of the module carrier system 1 including the collector modules 17th
权利要求:
Claims (10)
[1]
Reference number [0029] 1 base module carrier system 2 substrate support 3 mounting block 4 connecting element 5 fixing plate 6 nail 7 fixing screws 8 hole 9 arrowhead shape 10 screwing plate 11 screwing element 12 adhesive pad 13 contact surface 14 lower magnet block 15 upper magnet block 16 substrate filling 17 collector modules 18 retaining clip 19 latching bolt 20 protective film 21 bolt securing Patent claims
1. A module carrier mounting system for substrate, which produce by at least two elements, a mounting block 3 and a connecting element 4 a mounting connection for the base of module carrier systems 1 via at least one screw 7, wherein the mounting block 3 is firmly connected to the substrate substrate 2, whereby the on it lying substrate can be used as a ballast, which transmits the wind suction force on the positive connection between the mounting block 3 and the connecting element 4, wherein the form-fitting is given by an arrowhead shape 9 of the self-compressed fingers, and so the connection is maintained and guaranteed.
[2]
2. A substrate carrier mounting system according to claim 1, characterized in that the connection between the mounting block 3 and connecting element 4 by means of many fingers which are attached to the connecting element 4 or mounting block 3 and when installed in the top of the mounting block 3 or the bottom of the connecting elements 4 pre-drilled holes are pushed together and where the wind suction force are transmitted by friction effects, the frictional effect on the surface texture of the many fingers and the holes is generated and so the connection is maintained and guaranteed.
[3]
3. A module carrier mounting system for substrate according to claim 1, characterized in that the connection between the mounting block 3 and connecting element 4 by means of heel fingers, which are attached to the connecting element 4 or the mounting block 3 and when installed in the on the top of the mounting block 3 or the underside of the connecting element 4 network-like integrated thick layer are pushed together and thereby transmitted over the heels on the woven layer, the wind suction force and so the connection is maintained and guaranteed.
[4]
4. A module carrier mounting system for substrate according to claim 1, characterized in that the connection between the mounting block 3 and connecting element 4 by mushroom forming fingers, which are attached to the connecting element 4 or on the mounting block 3 and when installed in the on the top of the mounting block 3 or the underside of the connecting element 4 network-like integrated thick layer are pushed together and thereby transmitted via the mushroom shape on the woven layer, the wind suction force and so the connection is maintained and guaranteed.
[5]
5. module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and the base module carrier system 1 directly via at least one screw 11, at least one screw 7 and at least one screw 10 is achieved, wherein the screw 11 at the assembly deforms and so the connection is held and guaranteed.
[6]
6. module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and the base module carrier system 1 directly via at least one screw 11, at least one screw 7 and at least one screw 10 is achieved, wherein the screw 11 in the mounting block is poured or glued or pressed and so this connection is held and guaranteed.
[7]
7. module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and connecting element 4 via an adhesive connection is made, with an adhesive pad 12 is attached to the connecting element 4 or the mounting block 3 and on the mounting block 3 or the connecting element 4 has a specially prepared for this compound surface so that the connection is held and guaranteed.
[8]
8. module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and connecting element 4 via a magnetic connection is established, wherein a lower magnet block 14 or a metal plate for the upper magnet block 15 is integrated in the mounting block and an upper Magnetic block 15 or a metal plate for the lower magnet block 14 is located in the connecting element 12 and so the connection is held and guaranteed.
[9]
9. module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and connecting element 4 via a mechanical Einrastsystem «clip» comes about, wherein the mounting block 3 or in the connecting element 4 at least one latching opening and the connecting element or the mounting block 3 is at least one latching bolt which engages when positioning the base of the module carrier system 1 and so the connection is held and guaranteed.
[10]
10. Module carrier mounting system for substrate according to one of the preceding claims, characterized in that the connection between the mounting block 3 and connecting element 4 via mechanical support bracket 18 is achieved, wherein the mounting block 3 at least one headband 18 or shaping for at least one headband 18 and the connecting element at least one headband or shaping for at least one headband 18 is located, which can be locked together when positioning the base of the module carrier system 1, this can happen automatically or manually and so the connection is held and guaranteed.
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同族专利:
公开号 | 公开日
CH713105B1|2021-10-15|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题

法律状态:
2020-10-30| PUE| Assignment|Owner name: KILIAN WEHRLI GMBH, CH Free format text: FORMER OWNER: KILIAN WEHRLI, CH |
2021-03-15| PFA| Name/firm changed|Owner name: KWENERGY GMBH, CH Free format text: FORMER OWNER: KILIAN WEHRLI GMBH, CH |
优先权:
申请号 | 申请日 | 专利标题
CH01461/16A|CH713105B1|2016-11-02|2016-11-02|Module carrier mounting system for substrate.|CH01461/16A| CH713105B1|2016-11-02|2016-11-02|Module carrier mounting system for substrate.|
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